01
Mainly used forbonding and fixing electronic components, bonding and sealing of electronic control casings, and bonding of new energy vehicle battery trays and structural beams.


02
Features and Benefits
Silicone/MS/epoxy system;
Good adhesion, strength up to 3.0/4.0/16.5MPa;
Good thermal stability and high reliability;
Excellent toughness, resistance to humid and heat aging and hot and cold shock.